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FUJITSU MICROELECTRONICS DATA SHEET
DS05-13107-4E
Memory FRAM
CMOS
2 M Bit (256 K x 8)
MB85R2001
DESCRIPTIONS
The MB85R2001 is an FRAM (Ferroelectric Random Access Memory) chip consisting of 262,144 words x 8 bits of non-volatile memory cells created using ferroelectric process and silicon gate CMOS process technologies. The MB85R2001 is able to retain data without using a back-up battery, as is needed for SRAM. The memory cells used in the MB85R2001 can be used for 1010 read/write operations, which is a significant improvement over the number of read and write operations supported by Flash memory and E2PROM. The MB85R2001 uses a pseudo-SRAM interface that is compatible with conventional asynchronous SRAM.
FEATURES
* * * * * * Bit configuration Read/write endurance Operating power supply voltage Operating temperature range Data retention Package : 262,144 words x 8 bits : 1010 times/bit : 3.0 V to 3.6 V : - 40 C to + 85 C : 10 years ( + 55 C) : 48-pin plastic TSOP (1)
Copyright(c)2007-2009 FUJITSU MICROELECTRONICS LIMITED All rights reserved 2009.8
MB85R2001
PIN ASSIGNMENTS
(TOP VIEW)
A11 A9 NC A8 A13 WE CE2 A15 NC VCC NC NC GND NC NC VCC A17 A16 A14 A12 A7 A6 A5 A4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 OE NC GND A10 CE1 NC I/O8 I/O7 I/O6 I/O5 I/O4 VCC NC I/O3 I/O2 I/O1 NC NC NC A0 A1 GND A2 A3
(FPT-48P-M25)
PIN DESCRIPTIONS
Pin name A0 to A17 I/O1 to I/O8 CE1 CE2 WE OE VCC GND NC Address Input Data Input/Output Chip Enable 1 Input Chip Enable 2 Input Write Enable Input Output Enable Input Power Supply Ground No Connection Function
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BLOCK DIAGRAM
A0 * * * Address Latch.
Row Dec.
Ferro Capacitor Cell
to
A17 Column Dec. intCE2 S/A CE2 intCEB WE OE intCEB CE1 * * I/O8 to I/O1
intCE2
intOE intWE intCE2
I/O1 to I/O8
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MB85R2001
FUNCTION TRUTH TABLE
Operation Mode Standby Pre-charge CE1 H X X Read Read (Pseudo-SRAM, OE control*1) Write L Write (Pseudo-SRAM, WE control*2) L H H L L H H CE2 X L X H WE X X H H H L H Din OE X X H L Dout Operation (ICC) High-Z Standby (ISB) I/O1 to I/O8 Supply Current
L = VIL, H = VIH, X can be either VIL or VIH, High-Z = High Impedance : Latch address and latch data at falling edge, : Latch address and latch data at rising edge *1 : OE control of the Pseudo-SRAM means the valid address at the falling edge of OE to read. *2 : WE control of the Pseudo-SRAM means the valid address and data at the falling edge of WE to write.
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MB85R2001
ABSOLUTE MAXIMUM RATINGS
Parameter Supply Voltage* Input Voltage* Output Voltage* Ambient Operating Temperature Storage Temperature * : All voltages are referenced to GND = 0 V. WARNING: Semiconductor devices can be permanently damaged by application of stress (voltage, current, temperature, etc.) in excess of absolute maximum ratings. Do not exceed these ratings. Symbol VCC VIN VOUT TA Tstg Rating Min -0.5 -0.5 -0.5 -40 -40 Max +4.0 VCC + 0.5 VCC + 0.5 +85 +125 Unit V V V C C
RECOMMENDED OPERATING CONDITIONS
Parameter Supply Voltage* Input Voltage (high)* Input Voltage (low)* Operating Temperature Symbol VCC VIH VIL TA Value Min 3.0 VCC x 0.8 -0.5 -40 Typ 3.3 Max 3.6 VCC + 0.5 +0.8 +85 Unit V V V C
* : All voltages are referenced to GND = 0 V. WARNING: The recommended operating conditions are required in order to ensure the normal operation of the semiconductor device. All of the device's electrical characteristics are warranted when the device is operated within these ranges. Always use semiconductor devices within their recommended operating condition ranges. Operation outside these ranges may adversely affect reliability and could result in device failure. No warranty is made with respect to uses, operating conditions, or combinations not represented on the data sheet. Users considering application outside the listed conditions are advised to contact their representatives beforehand. WARNING:
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MB85R2001
ELECTRICAL CHARACTERISTICS
1. DC CHARACTERISTICS
Parameter Input Leakage Current Output Leakage Current Supply Current Symbol |ILI| |ILO| ICC Condition VIN = 0 V to VCC VOUT = 0 V to VCC, CE1 = VIH or OE = VIH CE1 = 0.2 V, CE2 = VCC - 0.2 V, IOUT = 0 mA*1 CE1 VCC - 0.2 V Standby Current Output Voltage (high) Output Voltage (low) ISB VOH VOL CE2 0.2 V*2 OE VCC - 0.2 V, WE VCC - 0.2 V*2 IOH = - 2.0 mA IOL = 2.0 mA VCC x 0.8 0.4 V V 10 50 A (within recommended operating conditions) Value Unit Min Typ Max 10 10 10 15 A A mA
*1 : During the measurement of ICC, the Address, Data In were taken to only change once per active cycle. IOUT: output current *2 : All pins other than setting pins should be input at the CMOS level voltages such as H VCC - 0.2 V, L 0.2 V.
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2. AC CHARACTERISTICS
* AC TEST CONDITIONS Supply Voltage Operating Temperature Input Voltage Amplitude Input Rising Time Input Falling Time Input Evaluation Level Output Evaluation Level Output Impedance (1) Read Operation (within recommended operating conditions) Parameter Read Cycle Time CE1 Active Time CE2 Active Time OE Active Time Pre-charge Time Address Setup Time Address Hold Time OE Setup Time Output Hold Time Output Set Time CE1 Access Time CE2 Access Time OE Access Time Output Floating Time (2) Write Operation (within recommended operating conditions) Parameter Write Cycle Time CE1 Active Time CE2 Active Time Pre-charge Time Address Setup Time Address Hold Time Write Pulse Width Data Setup Time Data Hold Time Write Setup Time DS05-13107-4E Symbol tWC tCA1 tCA2 tPC tAS tAH tWP tDS tDH tWS Value Min 150 120 120 20 5 50 120 0 50 5 Max Unit ns ns ns ns ns ns ns ns ns ns 7 Symbol tRC tCA1 tCA2 tRP tPC tAS tAH tES tOH tLZ tCE1 tCE2 tOE tOHZ Value Min 150 120 120 120 20 5 50 5 0 30 Max 100 100 100 20 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns : 3.0 V to 3.6 V : -40 C to +85 C : 0.3 V to 2.7 V : 5 ns : 5 ns : 2.0 V / 0.8 V : 2.0 V / 0.8 V : 50 pF
MB85R2001
3. Pin Capacitance
Parameter Input Capacitance Output Capacitance Symbol CIN COUT Condition VIN = VOUT = GND f = 1 MHz, TA = +25 C Value Min Typ Max 10 10 Unit pF pF
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TIMING DIAGRAMS 1. Read Cycle Timing (CE1, CE2 Control)
tRC tCA1 CE1 tCA2 tPC
CE2
tAS A0 to A17 Valid tES OE
tAH H or L tRP tCE1, tCE2 tOHZ High-Z Invalid
I/O1 to I/O8
tLZ Invalid
tOH Valid
2. Read Cycle Timing (OE Control)
tCA1 CE1
CE2
tCA2
tAS A0 to A17 Valid
tAH H or L tRC
OE
tRP
tPC
tOE tLZ I/O1 to I/O8 Invalid
tOH Valid
tOHZ High-Z Invalid
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MB85R2001
3. Write Cycle Timing (CE1, CE2 Control)
tWC tCA1 CE1 tPC
CE2 tAH
tCA2 tAS
A0 to A17
Valid
H or L
tWS WE
tWP
tDS tDH High-Z Data In Valid H or L
4. Write Cycle Timing (WE Control)
tCA1 CE1
CE2
tCA2
tAS A0 to A17 Valid
tAH H or L tWC tWP tPC
WE
tDS tDH High-Z Data In Valid H or L
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POWER ON/OFF SEQUENCE
tpd tr tpu
VCC CE2 3.0 V
VIH (Min)
VCC CE2 3.0 V
VIH (Min)
1.0 V
1.0 V
VIL (Max)
VIL (Max)
CE2 0.2 V
GND GND
CE1 > VCC x 0.8*
CE1 : Don't Care
CE1 > VCC x 0.8*
CE1
CE1
* : CE1 (Max) < VCC + 0.5 V Notes: * Use either of CE1 or CE2, or both for disenable control of the device. * Because turning the power-on from an intermediate level cause malfunction, when the power is turned on, VCC is required to be started from 0 V. * If the device does not operate within the specified conditions of read cycle, write cycle, power on/off sequence, memory data can not be guaranteed.
(within recommended operating conditions) Parameter CE1 level hold time for Power OFF CE1 level hold time for Power ON Power supply rising time Symbol tpd tpu tr Value Min 85 85 0.05 Typ Max 200 Unit ns ns ms
NOTES ON USE
After the IR reflow completed, it is not guaranteed to save the data written prior to the IR reflow.
ORDERING INFOMATION
Part number MB85R2001PFTN-GE1 DS05-13107-4E Package 48-pin plastic TSOP(1) (FPT-48P-M25) 11
MB85R2001
PACKAGE DIMENSIONS
48-pin plastic TSOP(1) Lead pitch Package width x package length Lead shape Sealing method Mounting height Weight 0.50 mm 12.00 x 12.40 mm Gullwing Plastic mold 1.20 mm MAX 0.37 g P-TSOP(1)48-12x12.4-0.50
(FPT-48P-M25)
Code (Reference)
48-pin plastic TSOP(1) (FPT-48P-M25)
Note 1) *1 : Resin protrusion. (Each side : +0.15 (.006) Max). Note 2) *2 : These dimensions do not include resin protrusion. Note 3) Pins width and pins thickness include plating thickness. Note 4) Pins width do not include tie bar cutting remainder.
0.100.05 (Stand off) (.004.002)
LEAD No.
1
48
INDEX
0.50(.020)
0.22 -0.04
*1 12.000.10 (.472.004)
+0.05 +.002
.009 -.002
0.10(.004)
M
24
25
14.000.20(.551.008)
*2 12.400.10(.488.004)
1.130.07 (Mounting height) (.044.003) Details of "A" part "A" 0~8
+0.05 +.002
0.08(.003)
0.145 -0.03 .006 -.001
0.25(.010)
0.600.15 (.024.006)
C
2003-2009 FUJITSU MICROELECTRONICS LIMITED F48043S-c-2-3
Dimensions in mm (inches). Note: The values in parentheses are reference values
Please confirm the latest Package dimension by following URL. http://edevice.fujitsu.com/package/en-search/
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MEMO
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MEMO
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MEMO
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MB85R2001
FUJITSU MICROELECTRONICS LIMITED
Shinjuku Dai-Ichi Seimei Bldg., 7-1, Nishishinjuku 2-chome, Shinjuku-ku, Tokyo 163-0722, Japan Tel: +81-3-5322-3329 http://jp.fujitsu.com/fml/en/ For further information please contact: North and South America FUJITSU MICROELECTRONICS AMERICA, INC. 1250 E. Arques Avenue, M/S 333 Sunnyvale, CA 94085-5401, U.S.A. Tel: +1-408-737-5600 Fax: +1-408-737-5999 http://www.fma.fujitsu.com/ Europe FUJITSU MICROELECTRONICS EUROPE GmbH Pittlerstrasse 47, 63225 Langen, Germany Tel: +49-6103-690-0 Fax: +49-6103-690-122 http://emea.fujitsu.com/microelectronics/ Korea FUJITSU MICROELECTRONICS KOREA LTD. 206 Kosmo Tower Building, 1002 Daechi-Dong, Gangnam-Gu, Seoul 135-280, Republic of Korea Tel: +82-2-3484-7100 Fax: +82-2-3484-7111 http://kr.fujitsu.com/fmk/ Asia Pacific FUJITSU MICROELECTRONICS ASIA PTE. LTD. 151 Lorong Chuan, #05-08 New Tech Park 556741 Singapore Tel : +65-6281-0770 Fax : +65-6281-0220 http://www.fmal.fujitsu.com/ FUJITSU MICROELECTRONICS SHANGHAI CO., LTD. Rm. 3102, Bund Center, No.222 Yan An Road (E), Shanghai 200002, China Tel : +86-21-6146-3688 Fax : +86-21-6335-1605 http://cn.fujitsu.com/fmc/ FUJITSU MICROELECTRONICS PACIFIC ASIA LTD. 10/F., World Commerce Centre, 11 Canton Road, Tsimshatsui, Kowloon, Hong Kong Tel : +852-2377-0226 Fax : +852-2376-3269 http://cn.fujitsu.com/fmc/en/
Specifications are subject to change without notice. For further information please contact each office. All Rights Reserved. The contents of this document are subject to change without notice. Customers are advised to consult with sales representatives before ordering. The information, such as descriptions of function and application circuit examples, in this document are presented solely for the purpose of reference to show examples of operations and uses of FUJITSU MICROELECTRONICS device; FUJITSU MICROELECTRONICS does not warrant proper operation of the device with respect to use based on such information. When you develop equipment incorporating the device based on such information, you must assume any responsibility arising out of such use of the information. FUJITSU MICROELECTRONICS assumes no liability for any damages whatsoever arising out of the use of the information. Any information in this document, including descriptions of function and schematic diagrams, shall not be construed as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right of FUJITSU MICROELECTRONICS or any third party or does FUJITSU MICROELECTRONICS warrant non-infringement of any third-party's intellectual property right or other right by using such information. FUJITSU MICROELECTRONICS assumes no liability for any infringement of the intellectual property rights or other rights of third parties which would result from the use of information contained herein. The products described in this document are designed, developed and manufactured as contemplated for general use, including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite). Please note that FUJITSU MICROELECTRONICS will not be liable against you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal operating conditions. Exportation/release of any products described in this document may require necessary procedures in accordance with the regulations of the Foreign Exchange and Foreign Trade Control Law of Japan and/or US export control laws. The company names and brand names herein are the trademarks or registered trademarks of their respective owners. Edited: Sales Promotion Department

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